CONTENTS
Volume 1, Number 2, 2012
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Electromigration-induced void evolution in upper and lower layer dual-inlaid Copper interconnect structures
D.J. Pete, S.G. Mhaisalkar, J.B. Helonde and A.V. Vairagar
Abstract | Full Text (2.65 MB)
pages 109-113.
DOI: 10.12989/amr.2012.1.2.109
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Structural and electrical properties of perovskite Ba(Sm1/2Nb1/2)O3–BaTiO3 ceramic
K. Amar Nath and K. Prasad
Abstract | Full Text (6.62 MB)
pages 115-228.
DOI: 10.12989/amr.2012.1.2.115
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Modeling and multiple performance optimization of ultrasonic micro-hole machining of PCD using fuzzy logic and taguchi quality loss function
Vinod Kumar and Neelam kumari
Abstract | Full Text (7.10 MB)
pages 129-146.
DOI: 10.12989/amr.2012.1.2.129
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Mechanical and metallurgical properties of diffusion bonded AA2024 Al and AZ31B Mg
G. Mahendran, V. Balasubramanian and T. Senthilvelan
Abstract | Full Text (13.1 MB)
pages 147-160.
DOI: 10.12989/amr.2012.1.2.147
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Preparation and characterization of nanoflake composite multi core–shell SrFe12O19/Fe3O4/PEG/PPy
Seyed Hossein Hosseini and Mohammad Majidpour diz
Abstract | Full Text (5.84 MB)
pages 161-168.
DOI: 10.12989/amr.2012.1.2.161