Advances in Materials Research

CONTENTS

Volume 1, Number 2, 2012

• Electromigration-induced void evolution in upper and lower layer dual-inlaid Copper interconnect structures

  D.J. Pete, S.G. Mhaisalkar, J.B. Helonde and A.V. Vairagar

  Abstract | Full Text (3K)

  pages 109-113.

  DOI: 10.12989/amr.2012.1.2.109

• Structural and electrical properties of perovskite Ba(Sm1/2Nb1/2)O3–BaTiO3 ceramic

  K. Amar Nath and K. Prasad

  Abstract | Full Text (7K)

  pages 115-228.

  DOI: 10.12989/amr.2012.1.2.115

• Modeling and multiple performance optimization of ultrasonic micro-hole machining of PCD using fuzzy logic and taguchi quality loss function

  Vinod Kumar and Neelam kumari

  Abstract | Full Text (7K)

  pages 129-146.

  DOI: 10.12989/amr.2012.1.2.129

• Mechanical and metallurgical properties of diffusion bonded AA2024 Al and AZ31B Mg

  G. Mahendran, V. Balasubramanian and T. Senthilvelan

  Abstract | Full Text (13K)

  pages 147-160.

  DOI: 10.12989/amr.2012.1.2.147

• Preparation and characterization of nanoflake composite multi core–shell SrFe12O19/Fe3O4/PEG/PPy

  Seyed Hossein Hosseini and Mohammad Majidpour diz

  Abstract | Full Text (6K)

  pages 161-168.

  DOI: 10.12989/amr.2012.1.2.161