Bonding evolution of bimetallic Al/Cu laminates fabricated by asymmetric roll bonding

Mohamad Heydari Vini , Saeed Daneshmand

Abstract

Roll bonding (RB) process of bi-metal laminates as a new noble method of bonding has been widely used in the production of bimetal laminates. In the present study, asymmetric roll bonding process as a new noble method has been presented to produce Al/Cu bimetallic laminates with the thickness reduction ratios 10%, 20% and 30% together with mismatch rolling diameter (R2/R1) ratio 1:1, 1:1.1 and 1:1.2. ABAQUS as a finite element simulation software was used to model the deformation of samples. The main attention in this study focuses on the bonding properties of Al/Cu samples. The effect of the R2/R1 ratios was investigated to improve the bond strength. During the simulation, for samples produced with R2/R1 = 1:1.2, the vertical plastic strain of samples was reach the maximum value with a high quality bond. Moreover, the peeling surface of samples after the peeling test was investigated by the scanning electron microscopy (SEM).

Key Words

asymmetric roll bonding; mismatch roll diameter; peeling test; bimetal laminates; numerical simulation

Address

(1) Mohamad Heydari Vini — Department of Mechanical Engineering, Mobarakeh Branch, Islamic Azad University, Mobarakeh, Isfahan, Iran
(2) Saeed Daneshmand — Department of Mechanical Engineering, Majlesi Branch, Islamic Azad University, Isfahan, Iran.

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