Advances in Materials Research
Volume 8, Number 1, 2019, pages 1-10
DOI: 10.12989/amr.2019.8.1.001
Bonding evolution of bimetallic Al/Cu laminates fabricated by asymmetric roll bonding
Mohamad Heydari Vini , Saeed Daneshmand
Abstract
Roll bonding (RB) process of bi-metal laminates as a new noble method of bonding has been widely used in the production of bimetal laminates. In the present study, asymmetric roll bonding process as a new noble method has been presented to produce Al/Cu bimetallic laminates with the thickness reduction ratios 10%, 20% and 30% together with mismatch rolling diameter (R<sub>2</sub>/R<sub>1</sub>) ratio 1:1, 1:1.1 and 1:1.2. ABAQUS as a finite element simulation software was used to model the deformation of samples. The main attention in this study focuses on the bonding properties of Al/Cu samples. The effect of the R<sub>2</sub>/R<sub>1</sub> ratios was investigated to improve the bond strength. During the simulation, for samples produced with R<sub>2</sub>/R<sub>1</sub> = 1:1.2, the vertical plastic strain of samples was reach the maximum value with a high quality bond. Moreover, the peeling surface of samples after the peeling test was investigated by the scanning electron microscopy (SEM).
Key Words
asymmetric roll bonding; mismatch roll diameter; peeling test; bimetal laminates; numerical simulation
Address
(1) Mohamad Heydari Vini:
Department of Mechanical Engineering, Mobarakeh Branch, Islamic Azad University, Mobarakeh, Isfahan, Iran;
(2) Saeed Daneshmand:
Department of Mechanical Engineering, Majlesi Branch, Islamic Azad University, Isfahan, Iran.
PDF Viewer
Preview uses the same access rules as Full Text PDF (subscription, purchase, or open access).
Loading…
Download PDF
