Advances in Materials Research
Volume 8, Number 1, 2019, pages 1-10
DOI: 10.12989/amr.2019.8.1.001
Bonding evolution of bimetallic Al/Cu laminates fabricated by asymmetric roll bonding
Mohamad Heydari Vini and Saeed Daneshmand
Abstract
Roll bonding (RB) process of bi-metal laminates as a new noble method of bonding has been widely used in the production of bimetal laminates. In the present study, asymmetric roll bonding process as a new noble method has been presented to produce Al/Cu bimetallic laminates with the thickness reduction ratios 10%, 20% and 30% together with mismatch rolling diameter (R<sub>2</sub>/R<sub>1</sub>) ratio 1:1, 1:1.1 and 1:1.2. ABAQUS as a finite element simulation software was used to model the deformation of samples. The main attention in this study focuses on the bonding properties of Al/Cu samples. The effect of the R<sub>2</sub>/R<sub>1</sub> ratios was investigated to improve the bond strength. During the simulation, for samples produced with R<sub>2</sub>/R<sub>1</sub> = 1:1.2, the vertical plastic strain of samples was reach the maximum value with a high quality bond. Moreover, the peeling surface of samples after the peeling test was investigated by the scanning electron microscopy (SEM).
Key Words
asymmetric roll bonding; mismatch roll diameter; peeling test; bimetal laminates; numerical simulation
Address
(1) Mohamad Heydari Vini:
Department of Mechanical Engineering, Mobarakeh Branch, Islamic Azad University, Mobarakeh, Isfahan, Iran;
(2) Saeed Daneshmand:
Department of Mechanical Engineering, Majlesi Branch, Islamic Azad University, Isfahan, Iran.