Effect of thickness stretching and multi-field loading on the results of sandwich piezoelectric/piezomagnetic MEMS

Xiaoping Zou , Gongxing Yan , Wangming Wu , Wenjie Yang , Weiwei Shi , Yuhusun Sun

Abstract

Bending static and stress investigation of a microplate of piezoelectric/piezomagnetic material subjected to combined multifield loading. Shear deformable as well as thickness stretched model is used for derivation of the kinematic relations. Multi field governing equations are derived analytically through principle of virtual work. the results are analytically obtained analytically including magnetic/electric potentials, displacement and stress components with variation in multifield loading parameters.

Key Words

deflection and stress analysis; higher-order model; sandwich piezoelectric/piezomagnetic microplate; smalldependent; virtual work principl

Address

Xiaoping Zou — Sichuan Jinghengxin Construction Engineering Testing Co., Ltd, Luzhou 646000, China
Gongxing Yan — 1)School of Intelligent Construction, Luzhou vocational and technical college, Luzhou 646000, China 2)Luzhou Key Laboratory of Intelligent Construction and Low-carbon Technology, Luzhou 646000, China
Wangming Wu — Aneng Third Bureau Chengdu Engineering Quality Testing Co., Ltd, Chengdu 611130, China
Wenjie Yang — Sichuan Jinghengxin Construction Engineering Testing Co., Ltd, Luzhou 646000, China
Weiwei Shi and Yuhusun Sun — Aneng Third Bureau Chengdu Engineering Quality Testing Co., Ltd, Chengdu 611130, China

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