Structural Engineering and Mechanics

Volume 64, Number 1, 2017, pages 81-92

DOI: 10.12989/sem.2017.64.1.081

Analytical and numerical study of temperature stress in the bi-modulus thick cylinder

Jinling Gao, Peikui Huang, and Wenjuan Yao

Abstract

Many materials in engineering exhibit different modulus in tension and compression, which are known as bimodulus materials. Based on the bi-modulus elastic theory, a modified semi-analytical model, by introducing a stress function, is established in this paper to study the mechanical response of a bi-modulus cylinder placed in an axisymmetric temperature field. Meanwhile, a numerical procedure to calculate the temperature stresses in bi-modulus structures is developed. It is proved that the bi-modulus solution can be degenerated to the classical same modulus solution, and is in great accordance with the solutions calculated by the semi-analytical model proposed by Kamiya (1977) and the numerical solutions calculated both by the procedure complied in this paper and by the finite element software ABAQUS, which demonstrates that the semi-analytical model and the numerical procedure are accurate and reliable. The result shows that the modified semi-analytical model simplifies the calculation process and improves the speed of computation. And the numerical procedure simplifies the modeling process and can be extended to study the stress field of bi-modulus structures with complex geometry and boundary conditions. Besides, the necessity to introduce the bi-modulus theory is discussed and some suggestions for the qualitative analysis and the quantitative calculation of such structure are proposed.

Key Words

bi-modulus thick cylinder; axisymmetric temperature field; stress function; semi-analytical solution; numerical procedure

Address

Jinling Gao: School of Aeronautics and Astronautics, Purdue University, West Lafayette, IN 47907, USA Peikui Huang: College of Engineering, South China Agricultural University, Guangzhou 510642, China Wenjuan Yao: Department of Civil Engineering, Shanghai University, Shanghai 200444, China